Course Objectives
Created in July 1995 last updated 24 June 1999
To understand the fundamentals of electrochemical processes and the effect of variables on the plating quality in electroplating, electroless plating, immersion plating, conversion coatings (phosphating and anodizing) and electrocforming.
This course thoroughly and systematically covers the fundamentals of electrochemical processes in metal plating and the effect of variables on the quality of plating. The following topics will be covered in the course:
1. Fundamental concepts in electrochemistry
2. Fundamentals of Electroplating
2.1 The Hull Cell and Haring-Blum Cell
2.2 The Mechanism of Electrodeposition of Metals
2.3 The Anodes
2.4 The Plating Bath
2.5 Typical Application Areas For Electroplating
2.6 Electroplating in the Electronics Industry
2.7 The Importance of Component Design
3. Electroless plating
3.1 Fundamentals of Electroless Deposition
3.2 Composition of Electroless Plating Baths
3.3 Operating Conditions
3.4 Properties of Electroless Deposits
3.5 Applications of Electroless Deposition
3.6 Electroless Deposition of Composites
4. Conversion Coatings
4.1 Anodizing
4.2 Phosphating
4.3 Chromating
5. Electroforming
5.1 The Electroforming Process
5.2 Electroforming of Foil
5.3 Electrolyte for Electroforming
This course has been structured in such a way that it is particularly suited for the designers, technologists, engineers and QA/QC personnel in industries such as microelectronics, semiconductors, metal finishing and general engineering.